Quality Assurance

A. To reduce the risk of device damage the CML packaging procedure is not to fully evacuate the air from the MBB before sealing. This process does not affect the MBB’s resistance to moisture ingress. CML’s procedure is based on the JEDEC recommendation, J-STD-033C section 3.3.5.3

A. CML has introduced a RoHS Compliant, Lead-free (Pb-free) Program in response to legislation calling for companies to utilise Pb-free manufacturing processes and components. Also, many of our customers are requesting products that utilize Pb-free manufacturing processes and components.

A. In December 2002, the European Union Parliament approved the content of two directives to better control the management of waste electronic equipment. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Reduction of Hazardous substances (RoHS). The WEEE addresses the collection and treatment requirements of waste electronic equipment for the member countries. The RoHS sets phase-out dates for the use of Pb and several other materials contained in electronic products. The RoHS requires that on July 1, 2006, the targeted materials shall no longer be contained in the electronic products above certain limits unless there is an exemption provided in the rule.

A. CML is working together with several industry consortia and forums to offer RoHS compliant (Pb-free) product alternatives. CML is working with its suppliers and customers to offer RoHS Compliant (Pb-free) products.

A. There are many standards and organisations that address the Pb-free issue. Here are some of the key organisations:

o        ANSI – The American National Standards Institute

o        EIA – Electronic Industries Association (http://www.eia.org/ and http://www.jedec.org/)

o        IEEE – The Institute of Electrical and Electronics Engineers

o        IPC – Association Connecting Electronics Industries

o        SMTA – The Surface Mount Technology Association

o        NCMS – National Centre for Manufacturing Sciences

o        NEMI – National Electronics Manufacturing Initiative

o        EICTA – European Information, Communications and Consumer Electronics Industry Technology Association

o        JGPSSI – Japanese Green Procurement Supply Survey Initiative

o        JEITA – Japanese Electronics & Information Technology Industries Association

o        PCIF – Printed Circuits Interconnection Federation

A. A component or assembly shall be defined as containing no Pb when the Pb content of the device is less than 0.1% by weight and is not intentionally introduced. This definition is in accordance to IPC/EIA J-STD-006.

A. A 260°C solder reflow profile can be used for all Pb-free devices please see attached link: Solder Profile

A. CML recommends a maximum number of reflows to be 3 times when the recommended solder reflow profile is used.  For example, reflow + removal + reflow would be 3 reflows.

A. CML recommends a maximum number of reflows to be 3 times when the recommended solder reflow profile is used.  For example, reflow + removal + reflow would be 3 reflows.

A. 100% Matte tin for all package styles except LS/L2 (PLCC24), which uses Sn96Ag4.

A. Please contact your local representative for the appropriate Material Data Sheet for any CML package style.

A. Your first contact point should be your local representative or distributor, their details are available elsewhere on this website.
Please ensure the requirement for RoHS compliant (Pb-Free) products is detailed on all purchase order paperwork.

A. All RoHS compliant shipping materials will clearly be labelled with either e2 or e3 labels as shown in Figure 1 on the RoHS Shipping Labels Document.

By definition enclosed devices will be lead free.

In addition, if devices are shipped in moisture barrier bags a label disclosing the MSL level of the devices within the package will also be attached; please see Figure 2 on the RoHS Shipping Labels Document.
Devices that are MSL level 1 will be shipped without this additional label.
On Acknowledgments, Despatch Notes and Invoices, items will be marked as “Lead-Free Product” where appropriate.

A. Pb-free products will have appropriately labelled packaging.

A. All RoHS compliant (Pb-free) products are backwards compatible and qualified for a lower temperature (220°C to 240°C) Pb process and solder.
CML can provide solderability test results if required by the customer.

CML can confirm that RoHS compliant devices can and have been successfully soldered with Pb- based solders.
Pure matte Sn has been chosen by CML due to its history of reliable performance in Sn-Pb soldering processes and its compatibility with Pb-free soldering. CML has carried out research to determine that its Pb-free devices perform at standard Sn-Pb reflow temperatures.

A. CML has qualified the following Pb-free composition: Sn 96%, Ag 3.5% and Cu0.5%. At this time, we have no specific plans to qualify any other solder types.

A. CML qualification testing of components and assemblies included the following areas:

o        260°C Pb-free High Temperature Reflow

o        I/O Lead Solderability

o        Resistance to Soldering Heat

o        Temperature Cycle

o        PCT

CML can provide technical information and reliability qualification data, as required, to assist customers with their concerns. Pb-free component and assembly test results can be obtained from your CML sales representative.

A. Pb-free components and assemblies manufactured by CML are qualified for use in PCB assembly processes using either SnPb or SnAgCu solders. CML qualification testing indicates that our Pb-free components and assemblies can be used interchangeably in either PCB assembly process.