This section is intended to give you access to up-to-date CML (encapsulation) package information. CML publications containing specifications of all CML Package Styles, Tape and Reel Dimensions and Solder. Package information specific to each product is provided on our Product pages, in the ‘Package’ tab at the bottom of each page.
Note: For the purposes of this page, the physical IC connection descriptions of ‘pin’, ‘leadless’ and ‘pin’ etc. are represented by the single term of ‘pin’.