Quality Assurance

Reliability

Design for Reliability

New products are only approved for production after undergoing the CML Micro approved formal design process that has been certified to ISO 9001:2015.

A design authority is allocated at the conceptual stage of the project. This person is responsible for the technical aspects of the design, both throughout the design stages and during the lifetime of the product.

Design rules automatically check and ensure that IC layouts comply with the appropriate requirements for the design and technology.

Design verification includes automated simulation, design checking, layout checking, evaluation of prototypes and characterisation.

Design reviews are held at critical stages throughout the design. This ensures that all necessary requirements have been met before continuing on to the next stage of the design process.

 

Manufacture for Reliability

Package manufacturing is carried out at the CML Micro assembly facility certified to ISO 9001:2015 or by similarly qualified outside sources.

A process owner is allocated to each process used within the CML Micro production life cycle. The person is responsible for all process qualification and approval.

The CML Micro Quality Managers are responsible for ensuring that reliability qualification tests are planned, carried out, and any problems resolved.

 

Reliability Qualification Test Items and Conditions

Typical conditions for reliability qualification tests are illustrated below:

  Test Items Test Conditions Reference Standard Qualification Sample Action
Life Test Operating Life Test TA 125°C : 1000 hours Mil Std 883K
Method 1005.10
40 Minimum (normally77) Report FIT Rate
Stress Test Latchup 1.5 x Vdd max. 100mA max. I trigger
-0.5 x Vdd max -100mA max I trigger
1.5 x Vdd max V supply volts overload
EIA/JESD78D 6 Results as Recorded
ESD Human Model up to 4000V Mil Std 883K
Method 3015.8
6 Results as Recorded
Environmental Test Temperature Cycle[1] -65°C to 150°C : 500 cycles Cycles
Mil Std 883K
Method 1010.8
45 Accept/Reject
0 / 1
High Temperature
Store
TA 150°C : 1000 hours Mil Std 883K
Method 1008.2
45 Accept/Reject
0 / 1
Low Temperature
Store
TA -65°C : 1000 hours EIAJ ED-
4701/202
45 Accept/Reject
0 / 1
PCT 121°C RH 100% : 96 hours JESD22-A102E 45 Accept/Reject
0 / 1
Thermal Shock -65°C to +150°C : 100 cycles
or
-55°C to +125°C : 300 cycle
Mil Std 883K
Method 1011.9
45 Accept/Reject
0 / 1
Mechanical Test Resistance to
Soldering Heat
Test
260°±5° C Mil Std 750-2A
Method 2031.5
Condition B
10 Accept/Reject
0 / 1
Solderability 245°C : 5 seconds
Flux Used
Mil Std 883K
Method 2003.9
10 Accept/Reject
0 / 1
Lead Fatigue Bend 90°
3 cycles
Mil Std 883K
Method 2004.6
10 Accept/Reject
0 / 1
Lead Tension 250 grams pull
30 seconds
Mil Std 883K
Method 2004.6
10 Accept/Reject
0 / 1
Marking Permanence 3 Solvent Solutions
1 Minute Soak
30 Brush Strokes
Mil Std 883K
Method 2015.13
8 per Solvent Accept/Reject
0 / 1

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