mmWave Packaging

As wireless systems move towards higher frequencies, packaging plays an increasingly important role in overall RF performance. At mmWave frequencies, the interaction between the semiconductor, package and PCB has a direct impact on signal integrity, efficiency, bandwidth and thermal performance. Optimising these elements together is essential to achieving reliable, high-performance wireless systems.

mmWave Packaging

As operating frequencies increase, packaging becomes an integral part of the RF design rather than simply a means of protecting the device. Parasitic effects that are insignificant at lower frequencies can limit performance at mmWave frequencies, making careful optimisation of the complete RF signal path essential.

At CML Micro, mmWave packaging is developed using a system-level approach that considers the semiconductor, package and PCB as a single design. Through advanced electromagnetic modelling, simulation and measurement, we optimise package transitions, minimise parasitic effects and ensure designs deliver the required performance in production as well as in simulation.

Our expertise spans a wide range of advanced packaging technologies, including high-performance QFN, wafer-level chip scale packaging (WLCSP), flip-chip assembly and integrated antenna solutions. As a fabless semiconductor company, we are free to select the most appropriate packaging technology for each application, balancing RF performance, thermal management, manufacturability and cost.

By combining deep RF design expertise with a technology-independent approach to packaging, CML Micro develops robust mmWave solutions for demanding communications, aerospace and defence, industrial and sensing applications. As wireless systems continue to evolve towards higher frequencies and wider bandwidths, advanced packaging remains a key part of our innovation strategy.